Cutting Emissions of Greenhouse Gases Other than CO2

The target of Stage VI Fujitsu Group Environmental Protection Program

• Reduce total greenhouse gas emissions associated with manufacturing globally to 6% below FY1990 levels by end of FY2012 (CO2: 5% reduction, other greenhouse gases: 20% reduction).

Activity results

The semiconductor industry has established a voluntary action plan to cut the emissions of PFC, HFC and SF6, which are all greenhouse gases.

We in the Fujitsu Group have set a target of reducing emissions by 10% relative to FY 1995 levels by the end of FY 2010, which is the industry target, and furthermore have set a target of a 20% reduction by the end of FY 2012 for the Fujitsu Group Environmental Protection Program (Stage VI). In our semiconductor divisions, we have changed to gases with a lower global warming potential and, for example, continue to install equipment to extract harmful materials in new and existing fabrication lines.

In FY 2010, we reduced the amount of these emissions measured in global warming potential (GWP) equivalent by 101 thousand tons to about 171 thousand tons by changing gases used and other measures as well as installing 15 new harmful materials extraction units. Since this corresponds to a 33.9% reduction compared to FY 1995, we succeeded in achieving the industry target.

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• Efforts to Prevent Global Warming
  • Reducing Greenhouse Gas Emissions Associated with Manufacturing
  • Cutting Emissions of Greenhouse Gases Other than CO2
  • Use of renewable energy
  • Efforts Related to Scope 3