Metro-Access Products

ETHOS – Ethernet over SDH/Sonet
MB87Q2060 – Single-chip SDH/Sonet Add-Drop Multiplexer

ETHOS – Ethernet over SDH/Sonet

PDF ETHOS Fact Sheet [178 KB]
PDF ETHOS Applications [376 KB]

The new chip provides a highly integrated solution for optical access and metropolitan networks. Only a few additional components are needed to build a system that transports data traffic via Gigabit Ethernet over an SDH/ Sonet network. The chip is named ETHOS, short for ETHernet Over SDH/Sonet. Due to its high level of integration an equipment developer can create very compact and cost effective access products. It provides the basis for next generation systems for high-speed access to the Internet and for data and voice transport between wireless networks and the optical backbone.

The ETHOS device MB87M2181 holds 2 x STM-1/OC-3, STM-4/OC-12 multi-rate line interfaces plus 2x STM-1/OC-3 fixed-rate tributary interfaces that connect glueless to hot-pluggable SFP modules. As client interface four E1/DS1, four Gigabit Ethernet or Fast Ethernet and a Telecom bus is supported. It integrates a High Order and Low Order cross connect, 4 Virtual Concatenation Groups, integrated G.813 SEC / GR-1244 Stratum-3 Network Element clock timing reference generation. The device supports low-latency and hitless LCAS (G.7042), GFP, LAPS and PPP mapping of Ethernet frames.

MB87Q2060 – Single-chip SDH/Sonet Add-Drop Multiplexer

PDF MB87Q2060 Fact Sheet [117 KB]
PDF MB87Q2060 Applications [518 KB]

The new chip provides a highly integrated single-chip solution for an add/drop, that will enable the creation of reliable, leading-edge networks. The MB87Q2060 integrates all the features that are critical for applications in metro and access networks with line rates up to 2.5Gbps. The device supports grooming, automatic protection switching and performance monitoring for more than 3000 VT1.5 or VC12 channels. The high-density VT/VC device also features line and backplane framers, cross connects at VT1.5, VC12, VC3, STS1 and VC4. With this new chip, Telecom equipment manufacturers can now build OC-48/STM-16 multi-service provisioning platforms (MSPP) or optical edge devices (OED) in a compact 1 RU high chassis.