Packaging

• BCC
• Super CSP
• QFP
• FBGA

Fujitsu, a world leader in packaging and interconnect technology, offers an extensive range of packaging options from industry standard Quad Flat Pack (QFP) and a wide variety of Ball Grid Array (BGA) configurations. These value added packaging solutions enable customers to achieve the high level of integration, performance and compactness required in their innovative product development. Fujitsu's environmental engagement allows to offer all wire-bond packaging solutions today in lead free versions. Reduced lead FCBGA are available, planning to provide all packages in lead-free versions in the near future.

Our customers will find the optimum silicon/package solution, allowing maximum system integration, electrical performance, thermal resistance, signal count, reliability and PCB space restrictions for leading edge ASIC designs.

Additional packaging solutions like Multi-Chip Modules (MCM) or customized package designs to optimize chip layout, electrical or thermal characteristics can be provided on request.