Packaging Options

Fujitsu, a world leader in packaging and interconnect technology, offers an extensive range of packaging options from industry standard Quad Flat Pack (QFP) and a wide variety of Ball Grid Array (BGA) configurations. These value-added packaging solutions enable customers to achieve the high level of integration, performance and compactness required in their innovative product development. Fujitsu's environmental engagement enables us to offer all packaging solutions today in lead-free versions.

Our customers will find the optimum silicon/package solution, allowing maximum system integration, electrical performance, thermal resistance, signal count, reliability and PCB space restrictions for leading-edge ASIC designs.

Additional packaging solutions such, as Multi-Chip Modules (MCM) or customized package designs to optimise chip layout, electrical or thermal characteristics, can be provided on request.

As part of its complete ASIC system solution, Fujitsu offers package design and customisation for high performance designs, with co-design of the IC, package and PCB where required. This is especially crucial for high-speed interfaces and mixed signal devices, where the combination of package and device needs to be optimised so as to reduce jitter and eliminate cross-talk effects.