Communications

FME provides its customers with advanced solutions for communications, networking and telecom applications, together with fingerprint sensors catering for today's demanding security and authentication requirements. Solutions are achieved through a combination of world class IP, leading-edge wireless and mixed signal design, fast and accurate design flow, advanced deep sub-micron semiconductor, MEMS process technologies and superior packaging.

Proven hierarchical design methodology based on leading-edge, industry-standard commercial tools consistently delivers fast timing closure success for multi-million gate designs… and these are designs that perform; thanks to robust process technologies down to 90nm, fast processor cores and high-speed I/O macros.

High speed interfacing

Interoperability is assured through OIF and XAUI compliant SERDES interfaces. These include clock-data recovery at rates from 622Mbps to 3.2Gbit/s, and a range of source synchronous macros, covering SPI-4, SFI-4 and SFI-5 standards, as well as high-speed RGMII, HSTL, LVDS and SSTL I/Os. Complementing these is a wide choice of processor cores (ARC, ARM, DSP, multi-channel VOIP), peripherals, memory controllers and connectivity solutions including USB 2.0, PCI and 10/100/1000 Ethernet MACs.

Examples of FME successes include: ASICs at the core of a packet switching solution featuring RGMII, SPI-4.2 and physical layer 10Gbit/s interfaces; the world's first 12-port 10Gbit/s Ethernet switching chip allowing higher-density system design at a lower cost; seven SoCs for the industry's first infrastructure-class routing platform; and very high pin-count (700-100 pins) ASICs in enhanced BGA packages for a leading-edge family of high-performance, end-to-end switching and routing products.

Fujitsu is committed to leadership in broadband wireless access – and our solutions will enable development of a new generation of WiMAX-compliant broadband wireless access (BWA) equipment.

Faster time to revenue

Such designs can draw from FME's advanced manufacturing facilities, in-house assembly and test for high-performance flip-chip packing, foundry services and a range of specialist services for burn-in, load boards and test boards. The result: faster, predictable design cycles and superior time-to-revenue.

With Fujitsu, the possibilities are infinite and the results are right first time.