PCB and I/O interconnects for the latest standards and technologies. Copper interconnects in a scaleable performance range for a variety of high-speed module applications.
Hoofddorp, July 16, 2009 – Fujitsu Components Europe, B.V. today introduced a vertical, surface-mount DDR2 (double data rate) DIMM (dual in-line memory module) socket connector with an enhanced contact design and 0.1mm lead coplanarity.
Hoofddorp, April 16, 2007 – Expanding its PCMCIA card connector offering, Fujitsu Components Europe, B.V. today released a very low-profile connector for micro SD/TransFlash™ cards. With a mounted height of 1.6mm, it is the lowest profile connector currently available for micro SD cards.
Hoofddorp, March 26, 2007 – Fujitsu Components Europe, B.V. today announced that a collaboration between its parent company, Fujitsu Components Limited, and Fujitsu Laboratories, Ltd. has resulted in the development of a three-dimensional (3D) polymer optical waveguide and a bi-directional, 4-channel optical parallel transceiver utilizing the 3D polymer optical waveguide as an optical integration platform, which simplifies the structure and assembly of the transceiver.
Hoofddorp, April 25, 2006 – Fujitsu Components Europe, B.V. today released the first in a series of new connector modules for 4x I/O to support high-speed signal transmission. The new modules offer a compact, cost-efficient way to increase I/O port density and available printed circuit board (pcb) space, while simplifying high-speed signal routing on the main pcb..
Hoofddorp, October 19, 2004 – Fujitsu Components Europe, B.V. today expanded the packaging options of its internal microGiGaCN™ (FCN-260) mezzanine connector offering by releasing a high-speed differential signal, right-angle SMT plug connector. With this latest addition, the microGiGaCN series now accommodates co-planar and perpendicular board-to-board connections, in addition to 8mm through and 14mm stacking (mezzanine) applications.