The Restriction of Hazardous Substances in Electrical and Electronic Equipment (ROHS) Directive (2002/95/EC)

Downloads

• PDF Fujitsu Group Conference for Explaining the Green Procurement Direction [545KB]
• PDF Statement Regarding the RoHS Compliance of Fujitsu IC Products [18.2KB]

Key elements

From 1 July 2006 new electrical and electronic equipment must not contain lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (PBBs) or polybrominated diphenyl ethers (PBDEs). These must be replaced by other substances. Before 13 February 2005 the European Commission will review the terms of the Directive to take into account any new scientific evidence.

The only substance listed above that Fujitsu Electronic Devices Semiconductor Division has or is using is Lead.

With customer agreement Fujitsu can provide Lead Free and therefore ROHS compliant products.

Quick links

• ROHS - The Quest for Lead (Pb) Replacement
• Fujitsu Lead Free Package Specification
• Fujitsu Mounting Rank List
• Fujitsu Flow Soldering Profile H
• Fujitsu Flow Soldering Profile M
• Identifying Lead Free Devices
• Summary

ROHS - The Quest for Lead (Pb) Replacement

Fujitsu Lead Free Package Specification

Ecologically friendly package with lead being eliminated from its terminal-use material and improved heat resistance.

• Heat resistance
  (IR Reflow) 240ºC x 2 Times à 260 ºC (250 ºC ) x 2 Times
• Terminal Material
  BGA = Sn-3.0Ag-0.5Cu (Lead-free) Tin with 3% Silver and 0.5% Copper QFP = Sn-2.0Bi (Lead-free) Tin with 2% Bismuth

Lead Free Packages have improved heat resistance to withstand the higher reflow temperature.

Change in terminal material requires customer to convert to Lead Free Solder Paste

Fujitsu Mounting Rank List

• Fujitsu has 2 major Flow Soldering Profiles that we call H rank and M rank.
• The rank is derived not just from the package type but from the Package - Lead-frame combination.
• Each Fujitsu Semiconductor Device will be given a 3 digit Mounting Rank.
• Example 1: H08 / H rank soldering profile to be carried out within 8 days of opening moisture proof packaging. 2 H rank reflows are allowed within the 8 days.
• Example 2: M06 / M rank soldering profile to be carried out within 6 days of opening moisture proof packaging. 2 M rank reflows are allowed within the 6 days.
• Example 3: HZ0 / H rank soldering profile to be carried out within 2 years of opening moisture proof packaging. 2 H rank reflows are allowed within the 2 years.

Fujitsu Flow Soldering Profile H

H-Rank (Peak temp. 260 °C)

* Package Surface Temp.

Fujitsu Flow Soldering Profile M

M-Rank (Peak temp. 250 °C)

Identifying Lead Free Devices

• Part Number: Add " E1 " to end of full part number
  eg MB90F548GSPF-G > MB90F548GSPF-GE1
• Marking: Add " E1 " to end of marking
• Format is different in a part or package where the marking space is insufficient.

• Attach lead-free label to mark on aluminum-laminated bag and on inner box

Summary

• Heat Resistance
  
  • H-Rank: 260 ºC x 2 Reflows
  • M-Rank: 250 ºC x 2 Reflows
  • Fujitsu recommend Sn-3.0Ag-0.5Cu solder paste. (for Lead-Free)
• Terminal Materials
  
  • BGA = Sn-3.0Ag-0.5Cu (Solder Ball)
  • QFP = Sn-2.0Bi (Plating)
• Discrimination of products
  
  • Part number ends with-"E1", Device Marked, Label with lead-free logo

The target is to make all Fujitsu Semiconductor Devices available lead free.

All Fujitsu ASIC Customers will have received a Product Change Notification.

Customers can contact either their local Fujitsu Sales Office or a Fujitsu Franchised Distributor if they wish to know the Mounting Rank for the devices they use.