概述 | 應用 |
快速循環隨機記憶體(FCRAM™)
富士通的快速循環隨機記憶體（FCRAM™）是一種具備創新技術的動態隨機記憶體（DRAM）核心架構，以近似DRAM的產品價格造就能比媲美SRAM產品的效能。FCRAM™全新的核心概念能透過獨有的管線運作和隱藏式預充電提模式，將隨機存取的週期時間降低到少於目前最快SDRAM技術(Rambus和DDR記憶體技術)的一半。此外，FCRAM™ 的多重分段記憶體核心在同樣匯流排頻寬運作條件下，耗電量不到SDRAM的一半。
富士通目前具備SRAM介面的FCRAM™樣本適用於各種手機應用，而具備DDR介面的FCRAM™樣本適用於各種網路應用。FCRAM™可針對各種應用的需求作進一步開發。所有以FCRAM™架構為基礎的ASM系列元件最早發表於1998年6月的VLSI研討會中。
[ FCRAM : Consumer FCRAM/Low Power SDRAM/LP-SDRAM/LPSDRAM/Mobile SDRAM ]
| Product name | Application bit | Organization (Bank x) W x b | Clock Frequency (Max.) MHz | Clock Period (Min.) ns | Access Time (Max.) ns | Supply Current Max. (Operating) mA | Supply Current Max. (Standby) uA | Supply Voltage V |
|---|---|---|---|---|---|---|---|---|
| MB81ES171625-12 | 16M | 2 x 512K x 16 | 85 | 11.7 | 10.2 | 30 | 1000 | +1.65 to +1.95 |
| MB81ES171625-15 | 16M | 2 x 512K x 16 | 66.7 | 15 | 12 | 30 | 1000 | +1.65 to +1.95 |
| MB81ES171625-15-X | 16M | 2 x 512K x 16 | 66.7 | 15 | 12 | 30 | 1000 | +1.65 to +1.95 |
| MB81ES173225-12 | 16M | 2 x 256K x 32 | 85 | 11.7 | 10.2 | 30 | 1000 | +1.65 to +1.95 |
| MB81ES173225-15 | 16M | 2 x 256K x 32 | 66.7 | 15 | 12 | 30 | 1000 | +1.65 to +1.95 |
| MB81ES173225-15-X | 16M | 2 x 256K x 32 | 66.7 | 15 | 12 | 30 | 1000 | +1.65 to +1.95 |
| MB81ES123245-10 | 128M | 4 x 1M x 32 | 108 | 9.2 | 7 | 5 | 500 | +1.7 to +1.9 |
[ FCRAM : Mobile FCRAM/Pseudo SRAM/pSRAM/COSMORAM ]
| Product name | Application bit | Organization (Bank x) W x b | Initial Access Time (Max.)ns | Page Mode Access Time (Max.)ns | Burst Clock Access Time (Max.)ns | Supply Current Max. (Standby)uA | Supply Current Max. (Power Down)uA | Shipping Style |
|---|---|---|---|---|---|---|---|---|
| MB82D01181E-60L | 16M | 1M x 16 | 60 | N/A | N/A | 100 | 10 | Chip or Wafer |
| MB82DS01181E-70L | 16M | 1M x 16 | 70 | N/A | N/A | 100 | 10 | Chip or Wafer |
| MB82DP02183C-65L | 32M | 2M x 16 | 65 | 20 | N/A | 80 | 10 | Chip or Wafer |
| MB82DP02183D-65L | 32M | 2M x 16 | 65 | 20 | N/A | 100 | 10 | Chip or Wafer |
| MB82DBS02163C-70L | 32M | 2M x 16 | 70 | 20 | 12 | 80 | 10 | Chip or Wafer |
| MB82DBS02163D-70L | 32M | 2M x 16 | 70 | 20 | 8 | 100 | 10 | Chip or Wafer |
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