125°C-Rated Memory for SiP

Fujitsu 256Mbit and 512Mbit Consumer FCRAM chips support operating temperatures up to 125°C operation for SiP. Extending the temperature range to 125°C allows the FCRAM to be used in a SiP together with a high power consumption SoC without overheating. Such a solution is ideal for high performance consumer electronics such as digital television and camcorders.

Why is 125°C-Rated Memory Required?

Background

Digital consumer electronics increasingly require the benefits of using a SiP configuration in which a SoC and memory are included in a single package, subsequently, SiP demand is growing.

Please visit SiP solution for details.

Issues of SiP Development

Thermal design has becomes a big issue for SiP development. As SoC power consumption becomes higher and higher, the result is much heat generation. In such cases when using SiPs, memory operation can be significantly affected the heat generation of the SoC. Recently there are some cases where a SiP can not be used because the memory device has a maximum operating temperature of 95℃ and is not high enough to be integrated with a high power consumption SoC. Therefore extending the operating temperature of the memory is demanded for almost all cases that memory is integrated with high power consumption SoCs in a SiP.

Solution

Fujitsu Consumer FCRAM can support operating temperatures up to 125℃ which resolves the above thermal design issue for using memory together with high power consumption SoCs in a SiP.

PDF Case Study of SiP Thermal Design (52KB)

Figure (a): 　
With an SoC of high power consumption, the SiP temperature becomes
105°C; however conventional memory can only operate up to 95°C so this configuration cannot be used.

Figure (b): 　
By adding a heat-sink the SiP temperature decreases so operation is feasible, however there is increased cost.

Figure (c):　
Using 125°C-rated FCRAM, even if the SiP temperature is 105°C it operates fine, and no heat-sink is necessary.

125°C-Rated FCRAM is Only Solution

SiP becomes feasible

• Resolves thermal design issue. No overheating.

Heat dispersers not necessary

• Reduced cost with no heat sink or heat spreader necessary.