SiP (System in Package) Solution

What is SiP?

SiP stands for "System in Package"; a technology and a product containing different semiconductor devices, such as memory devices and SoC (System on Chip) in a single package.

Background of SiP Applications

In recent years the SiP market has been growing strongly. Previously SiPs were mainly used for battery-operated application such as mobile phones, digital video cameras (DVC) requiring small mounting space and low power consumption. As DDR memory operating frequencies are getting higher, customers are facing serious cost and risk issues related with difficult thermal and timing design of high speed DDR memory interfaces. Therefore more customers, even in non-battery applications such as Digital TV (DTV) and Digital Video Recorders (DVR), prefer to use SiPs to integrate high speed memory and SoCs in one-package to create low cost and reliable memory system.

Fujitsu FCRAM SiP solution offers to reduce PCB area, number of PCB layers, passive parts for EMI (Electro-Magnetic Interference) & SI (Signal Integrity) and to reduce PCB development risk and to enable flexible end product design.

High-speed Memory: Issues and Solution

With system memory running faster this creates greater difficulty in design of transmission timing and noise reduction within the development of end-products. In addition, thermal design becomes complicated due to higher power consumption. Fujitsu Microelectronics’ FCRAM has the necessary features suited for SiP, and a SiP solution using the FCRAM reduces PCB design risk and developing costs.

PDF Issues of Typical Memory System and Solution (153 KB)

SiP Advantage of FCRAM

Fujitsu 256Mbit and 512Mbit Consumer FCRAM have features of being rated for 125°C operation, low power consumption and high data bandwidth, which are necessary for SiPs.

SiPs using 125°C-rated FCRAM can offer the technical advantages such as easier thermal design and cost advantages in reducing thermal dissipation costs compared to SiPs using conventional SDRAM (DDR2 or Low Power DDR) with max. operating temperature of 95°C.

125°C-Rated Memory for SiP 

PDF Feature Comparison between Conventional SDRAM(SiP) and FCRAM（SiP) (49 KB)

Case Study of SiP Solution

Case studies for digital television (DTV) and digital video camera (DVC) with SiP solutions using FCRAM are introduced.

PDF SiP Case Study for DTV (59KB)

PDF SiP Case Study for DVC (38KB)

Cost Structure for Memory System

Since the percentage of total system costs taken up by assembly and PCB costs is increasing, optimizing total system costs, including high speed memory systems, has become important. By shifting to a SiP configuration, PCB related costs can be reduced.

PDF Cost structure for Memory System （50KB)

What is the Best Solution for Your Target Application?

You can check if a SiP solution fits your target application using the “SiP Suitability Check Sheet” below.

PDF SiP Suitability Check Sheet (43KB)