Packaging
Fujitsu produces a comprehensive lineup of packages. In addition to surface-mounted packages QFP and HQFP, Fujitsu provides packages that include BGA and FCBGA to meet the application requirements of high pin-count.
Package Information
- PDF Package Outline Diagram Page Layout(132KB)
- PDF Package Lineup/ Forms/ Structures(424KB)
- PDF Package Description (How Package Dimensions Are Indicated/ Codes/ Marking)(45KB)
- PDF Packing for Shipment(1.24MB)
- PDF Packing handling precautions(30.9KB)
- PDF Package Mounting Methods (Mounting Methods/ Reliability/ Storage)(240KB)
- PDF Safety Precautions(23.1KB)
- PDF Handling Precautions(40.2KB)
Dimensions of Package
- Compact Packages
- Multipin Packages
