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2007-09-27
Fujitsu Microelectronics (Shanghai) Co. Ltd.


Fujitsu Launches High-Efficiency Power Management LSI for Ultra-Mobile PCs

Supports next LPIA platform and reduces PCB area of power management to less than1/3


Shanghai, September 27, 2007 —  Fujitsu Microelectronics (Shanghai) Co., Ltd. today announced the development of a one-chip system power management LSI for ultra-mobile PCs (UMPCs), to supply power to the system, memory, and chipsets in UMPCs (Ultra Mobile PCs).

As an industry first for one-chip integration, the MB39C308 complies with the upcoming version of the Low Power Intel Architecture (LPIA) specification proposed by Intel Corporation as a low-power platform for UMPCs. The MB39C308 also meets the next-generation LPIA platform requirement of a six-channel DC/DC converter (*1) control circuit, while integrating other peripheral components onto the chip. This enables the power management system to be reduced to less than one-third the size of other similar products. The increased efficiency of the new device’s power supply is a major factor in extending the operating time of the UMPC battery.

The MB39C308 was jointly developed with Fujitsu VLSI Limited, utilizing Laterally Diffused MOS (LDMOS) technology. By using an LDMOS technology and revising the transistor structure, the MB39C308 supplies power from a lithium-ion battery at high-efficiency rates without dispersion. The DC/DC converter control circuits incorporated in the chip generate voltages across six different channels and support power for memory, the chipset and external systems such as wireless LAN, as required in the 2008 version of the LPIA platform.

Also, a switching FET integrated in the MB39C308 can drive a current of 1.5 Amps to 3.5 Amps. This benefits the memory and chipset, reducing the number of peripheral components and the size of the power management system. In addition, by optimizing components to comply with the LPIA platform and embedding them into the power management IC, it becomes possible to eliminate the requirement to set voltage or current when designing power management systems.

Ultra-compact mobile PCs can run the same operating system as regular-sized PCs. For these UMPCs, it is necessary to supply differing voltages to the processor, chipset memory, and other parts. To extend the operating time of the battery, processor consumption must be reduced and power management ICs are required in order to reduce power supply system size, including control circuits that can supply a large current with high efficiency from a lithium ion battery.

Launched in 2006, the market for UMPCs is likely to reach five million units in 2008. Responding to the growing needs, Fujitsu plans to expand its line-up of power management LSIs for UMPCs.

Figure 1: Fujitsu's MB39C308 LSI for UMPCs (unit shown: cm)

Sample Pricing and Availability

  • Product name: MB39C308
  • Sample Price (including tax): JPY1000
  • Availability: From November 2007

Sales Target

150,000 units per month

Key Features

  • One-chip DC/DC converter control circuit, compliant with next LPIA platform for UMPCs
    DC/DC converter control circuits, which generate voltages across 6 different channels and which support power for memory (excluding the processor), the chipset and external systems (various applications such as wireless LAN) as outlined in the 2008 version of the LPIA platform, have been integrated onto a single chip.
  • Realizes high-efficiency power supply required for UMPCs
    By utilizing a new LDMOS technology (*2) and revising the transistor structure, this new LSI makes it possible to supply power from a lithium ion battery as a large current at high efficiency rates, without dispersion.
  • Reduced size and simplified design of power-managing system through reduction of peripheral components
    For the memory and chipset, by integrating into the power management LSI a switching FET (*3) capable of driving a large current of 1.5 Amperes to 3.5 Amperes, the number of necessary peripheral components has been reduced. This enables a size reduction of the power management system to less than one-third (1/3) that of conventional products from other companies. In addition, by optimizing various setting components so that they are compliant with the LPIA platform, and embedding them into the power management LSI, effort that had been required in the past to set voltage or current when designing power management systems is now alleviated.

Glossary

  • DC/DC converter:
    A circuit that converts the voltage level of a direct current, to a different voltage level.
  • LDMOS:
    LDMOS stands for Laterally Diffused MOS. Has the characteristic of being able to handle higher voltages than average CMOS.
  • Switching FET:
    A switch that supplies current from input to output. FET stands for Field Effect Transistor.

Specifications of the MB39C308

Voltage 5.5V~12.6V
Topology Current Mode (*1) 6 Channel (ch) voltage down conversion
Power Frequency 700KHz(20%) fixed
Output Precision (*2) 5.0% (transient response included *3)
Output Voltage Preset Ch1: 5.0V Ch2: 3.3V Ch3: 1.8V/1.5V Ch4: 0.9V/0.75V
Ch5: 1.5V Ch6: 1.1V/1.05V
Digital Software Start/Stop (*4) 1.7msec ~ 9msec variation
Power Good Function (*5) Ch1 ~ Ch6
Ch3 ~ Ch6 (memory, chipset) all power good function embedded
Protection Function UVLO/OCP/OVP/OTP/SCP/IVP (*6)
Operating Temperature Range -30°C ~ 85°C
Package Plastic BGA-208 pin

*1. Current Mode: DC/DC control format with current feedback.

*2. Power Supply Precision: Precision shown is with Fujitsu’s evaluation board and evaluation conditions.

*3. Transient Response: Output voltage change corresponding to an output current change.

*4. Digital Software Start/Stop: a function to start and stop the output voltage, that doesn’t depend on the output current, by using a digital counter internally in the LSI.

*5. Power Good Function: when the output voltage is 90%~110% of the set value, it outputs a signal.

*6. UVLO/OCP/OVP/OTP/SCP/IVP: Under Voltage Lockout / Over Current Protection / Output Over Voltage Protection / Over Temperature Protection / Short-Circuit Protection / Input Over Voltage Protection.


Fujitsu Microelectronics (Shanghai) Co.,Ltd.

Fujitsu Microelectronics (Shanghai) Co., Ltd. was established in August 2003 as Fujitsu’s semiconductor business representative in China. Headquartered in Shanghai, it has branch offices in Beijing and Shenzhen to provide sales and service support to customers throughout China.
Fujitsu Microelectronics (Shanghai) Co., Ltd. offers an extensive range of products from microcontroller, application-specific integrated circuit (ASIC), application-specific standard product (ASSP), system-on-chip (SoC) to system memory, that can be supplied as product or complete solution. With technology resource centres and ASIC design support centres strategically located in Shanghai, Hong Kong, and Singapore, as well as Heavy investments in design and engineering capabilities and application support resources, complemented by a regional network of design partners, suppliers and distributors, Fujitsu Microelectronics (Shanghai) Co., Ltd. can readily delivers innovative and value-added solutions and varied range of products to its target markets in China.
For more information, please see: http://cn.fujitsu.com/fmc/en


Press Contacts

Fujitsu Microelectronics (Shanghai) Co., Ltd
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Tel: +86-21-6146-3688
Fax: +86-21-6335-1605
E-mail:Marcom@fmc.fujitsu.com


21st Century Public Relations(Ogilvy & Mather Group)
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Tel: 021-2405-1631
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E-mail:chris.lu@ogilvy.com


Customer Contacts

Fujitsu Microelectronics (Shanghai) Co., Ltd
Marketing:Galvin Lian
Tel: +86-21-6146-3688
Fax: +86-21-6335-1605
E-mail:Galvin.Lian@fmc.fujitsu.com




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