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  5. Coreless FC-BGA Substrates GigaModule-4

Coreless FC-BGA Substrates GigaModule-4

Suitable for high frequency operation over 10GHz

GigaModule-4GigaModule-4
  • GigaModule-4 provides Ultra-Thin and High-density wiring structure, applying core layer free, full build-up, and full stacked-via technology.
  • Design/materials  corresponding to high-speed transmission over 30Gb/s are applicable. 
  • Low inductance property enables GHz bandwidth operation with lower transmission loss.
  • Realize improvement of  machine characteristics by applying a variety of materials
  • Offer simulation and design technology best suited for high-speed transmission
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SI Simulation Result for Hybrid Coreless Substrate SI Simulation Result for Hybrid Coreless Substrate

Features

Structure Coreless
Stacked via
Material Property
(Build-up)
TG (TMA) Conventional Type : 156℃
High Tg Type : 176℃
CTE (α1) Conventional Type : ≦ 50ppm
Low Thermal Type : ≦ 20ppm
Young's modulus
(GPa)
Conventional Type : ≦4GPa
High Rigidity Type : ≧ 5GPa
Loss tangent
(5.8GHz)
Conventional Type : ≦ 0.02
Low Loss Type : ≦0.008

Design Rule

[micron]
Total Thickness 220~900
Layer Construction 4~16

Build-up 

(MIC)

Dielectric Thickness 30 or 35 ( 40 )
min
Laser Via Diameter
φ60 ( φ40 )
min Line/Space 20 / 20 ( 15 / 15 )
Stacked VIA Usable

( ) : developing products

Applications

  • Server/MPU for HPC
  • ASIC/Logic/Graphics
  • FPGA

Construction

High Density IVHHigh Density IVH
Coreless constructionCoreless construction
GTM-PS6H6Z