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Physical Simulation

We support the optimization packaging design for the customer by our Thermal Management Analysis and Packaging Stress Analysis.

Thermal Management Analysis

We perform verification and evaluation for thermal structure, responding to each customer’s thermal problems for electronic devices. By performing our thermal management analysis in the early stages of the development phase, we help our customers in reducing cost and time during the development process.

Packaging Stress Analysis

Analyses that leverage our expertise in substrate manufacturing as well as Fujitsu Group’s experience in electronics manufacturing.