Schweiz
Worldwide
Our new technologies have succeeded in improving manufacturing yields and significantly reducing production lead time for high-count multi-layer PCB and are to be applied for use in such areas as next-generation, high-speed servers and telecommunication base station equipment.
Signal trace with smooth surface makes signal transmission loss lower. High performance PCB can be made without expensive base resin material.
Measured value of transmission characteristics for smooth treatment
We are currently developing a technology that electrically connects completed PCBs stacked together. We aim for higher density and further improvement in electrical property.
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