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- Board design
Board Design
We provide concurrent PCB design solution that integrate electrical and thermal fluid/stress simulations for customer's product developments.
Design PCBs with low warpages
Examples of PCB stress-strain analysis
We perform warpage analysis, using Cu ratio model based on the real PCB designs. We propose optimized PCB designs low warpages whether BGAs are used.
We optimize parts layout and trace pattern in terms of warpage reduction.
Design PCBs with joule heat analysis for high current applications
We propose optimal PCB designs with thermal analysis that integrate joule heat and device operating heat analysis.
1) Perform joule heat analysis with precise trace pattern modeling based on the real designs.
2) Improve trace flexibility with Embedded Bus Bar
3) Place control logic and power devices on the same surface layer.
Realize stable operation for high performance PCBs
Our optimized PCB design solutions for high performance applications reduce prototype cycles, lead-time, and cost.
1) Propose suitable PCB specifications
Optimum materials, Layer structure and design rules
2) Signal Integrity(SI)Analysis
Waveform quality and timing of high-speed DDRx interface.
3) Power Integrity(PI)Analysis
Power plane stability around power line of LSI core and I/O.
4) EMI analysis
Low noise design for EMI.
Reduce layer-count and electrical parts to satisfy the electrical performance.
1) Design Review
Minimize line width and Via diameter within target impedance(Z0) to increase routing channels.
2) Layout Review
Increase routing channels by replacing to smaller parts and displacing dumping registers.
3) Validation with simulation
Validate electrical performance by implementing transmission waveform simulation.
Layer count reduction with the compatible electrical performance and displacements of dumping registers enable cost-down of PCBs and PCBAs.
Design cycles reduction
Concurrent PCB designs with multiple users reduce design cycles by half, minimizing the prototype development lead-time for customers.
FUJITSU INTERCONNECT TECHNOLOGIES helps customers solve the design issues.
We provide comprehensive design solutions for performance, miniaturization, and cooling in a wide range of products, devices and modules.
High performance PCBs for Super Computers, ICT Infrastructure and Medical systems
| Board Size | 440 × 350mm |
|---|---|
| Structure | 24 Layers |
| Device counts | 8,400 |
| Device Pin counts | 39,000 pin |
| Wire counts | 30,000 wires |
High density PCBs for Automotive, mobile and IoT
| Board Size | 190 × 150mm |
|---|---|
| Structure | 6 Layers |
| Device counts | 2,000 |
| Device Pin counts | 6,000 pin |
| Wire counts | 2,400 wires |
Thick Cu PCBs for Industrial and Power electronics
(Thick Cu for high current use)
| Board Size | 180 × 110mm |
|---|---|
| Structure | 4 Layers |
| Device counts | 60 |
| Device Pin counts | 250 pin |
| Wire counts | 160 wires |
Semiconductor packaging substrates
| Board Size | 48 × 48mm |
|---|---|
| Structure | 18 Layers (6-6-6) |
| IO counts of DIE | 19,500 pin |
| BGA Pin counts | 2,100 pin |
High layer count PCBs for Semiconductor tests
| Board Size | 110 × 130mm |
|---|---|
| Structure | 26 Layers (10-6-10) |
| Device counts | 1,600 |
| Device Pin counts | 36,800 pin |
| Wire counts | 35,700 wires |
| Board Size | φ440mm |
|---|---|
| Structure | 52 Layers
|
| Device counts | 7,400 |
| Device Pin counts | 25,600 pin |
| Wire counts | 12,000 wires |
With our extensive experience in a wide variety of areas, we offer value-added design solutions for our customers.
We provide total PCB design solutions that include a wide range of simulations. We interface design data to a large variety of tools for electrical, thermal, and stress-strain simulations to add values to our customer's products.
CAE tools (CAD/CAE)
| Design Tool | Main Product Application | |
|---|---|---|
| CAD | CR-5000 Board Designer (ZUKEN) | Consumer products |
| Allegro Package Designer (Cadence) | Package substrates & testing | |
| CADVANCE (ZUKEN) | Semiconductor testing | |
| FUJITSU CAD | Concurrent PCB design with multi-users | |
| CAM | InCAM (FrontLine) | Design rule check for manufacturing (DFM) |
| PC-AutoCAM (Dynatron) | Optimization of design data (Gerber) | |
Note) All company or product names mentioned above are trademarks or registered trademarks of their respective owners.
Simulation Tools
| Simulation Tools | Main product application |
|---|---|
| DEMITASNX EMC Expert (NEC) | EMI Rule Check, Power/Ground Resonance Analysis |
| Signal Adviser-SI (FUJITSU) | Topology design, analysis of signal quality |
| Signal Adviser-PI (FUJITSU) | Analysis of power supply quality |
| HSPICE (SYNOPSYS) | Analysis for precise waveform |
| CST MICROWAVE STUDIO (CST) | Transmission loss and reflection noise analysis |
| FloTHERM (Mentor) | Thermal flow analysis |
| Abaqus (Dassault) | Stress-strain analysis |
Note) All company or product names mentioned above are trademarks or registered trademarks of their respective owners.
PCB Design Center
Our Design Centers are located in Japan and Vietnam, providing business efficiency and continuity to our customers.
Comprehensive Strength of the FUJITSU Group
We provide comprehensive solutions across all stage of the product development from circuit design through prototype development and evaluation to production.
The comprehensive strength of the FUJITSU Group brings additional value to our customer's product developments.
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