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HDI PCBs

build-up

Cutting edge high-reliability HDI technologies

HDI PCB Multi Via technology ensure high-reliability and high density wiring capacity in the board including.
  • Stacked via structure Wiring density improvement
  • By using copper plating technologies, filled via plating packaging density improvement.
  • Thin down by all layer stacked via structure (MV2E)

Design Rule

[mm]

MV2 MV2
Layer Construction 1-N-1
(N:2 ~ 10)
2-N-2
(N:2 ~ 10)
3-N-3
(N:2 ~ 8)
Max8
Thickness - 0.63
Via Diameter φ0.060
Land Diameter φ0.200
Line / Space 0.050 / 0.050(Inner Layer)

Applications

  • Vehicle equipment (Engine control unit, Car navigation system)
  • PC, Notebook computer
  • Mobile-phone, Module (CCD, LAN etc)
  • Compact audio-video equipment(digital video camera)

Construction

MV2 (Multi-Via 2) MV2E (Multi-Via 2 Enhanced)

It's a common buildup structure that build up layer at each side of core layer. It can improve wiring density by stacked via structure on buildup layer.

It's a lot of flexibility design that can lay out via arbitrarily by all layer stacked via. Building via using a laser on core layer, It follows that higher density wiring and thin thickness (8-layer : 0.63mm).

mv2_sec01
mv2e_sec01
Closeup stacked via
mv2_sec02
Closeup all layer stacked via
mv2e_sec02