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Substrates

Shinko offers a wide variety in IC- Substrates, either being it Substrates based on Prepreg technology, similar to PCB manufacturing, or ABF materials for more advanced applications.

Prepreg Substrates:

Shinko Prepreg Substrates Shinko Prepreg Substrates
Shinko Prepreg SubstratesShinko Prepreg Substrates
The Plastic-BGA substrates are mainly used for memory, controller, chipsets, and on-vehicles applications. They are characterized in the RIGID substrates with the base material containing glass cloth and also supplied by strip form. 
To meet customer's needs of smaller and higher density as substrates for Mobile devices, SHINKO can supply a multilayer Build-up substrate by applying “Finer pattern using a Semi-additives process” and “Stacked via." 
Moreover, to meet the demand of thinner substrates, SHINKO has developed the coreless package (IVH3) with an unmatched thin structure. These superlative coreless substrates are achieved by removing the core layer. Also, SHINKO will continue to focus on the development of the next generation substrates. 
These substrates will exhibit features that enable even higher-density, more compact and thinner package size required by future markets.

DLL: High Density Substrates

Related to the recent performance improvement of electronic devices using Build-up Substrates produced by the Direct Laser & Lamination (DLL®) Process, have seen increases in demand due to achieving the dual benefits of higher-speed and higher-density. SHINKO has achieved these requirements by providing Build-up Substrates that have the outstanding features of fine line patterning through the use of a semi additive process, multi-layer structure, excellent electric characteristics and design flexibility through the use of stacked via structures.

Also IC design and technology has accelerated the use of high-density and high-speed packages. These packages have strong requirements for high-density, good electrical performance and a thinner structure.

Therefore, SHINKO developed the coreless package(DLL3®) which has an unmatched thinner structure coupled with good electrical performance and high design flexibility. This superlative coreless package was achieved by removing the core layer which held back electrical performance and design flexibility.

Also, SHINKO will continue to focus on the development of the next generation packages. These packages will exhibit features that enable even higher-speed, higher-density, more compact and thinner package size required by future markets.

Shinko DLL: High Density Substrates block viewDLL
Shinko DLL: High Density Substrates interconnectDLL3