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Substrates Shinko DLL: High Density Substrates

Shinko offers a wide variety in IC- Substrates, ranging from 2 Layer Substrates in through hole type to high Layer count with high-density routing.

IC Assembly Shinko IC Assembly

Shinko undertakes IC package assembly on consignment, and use plastic laminated substrates, tape substrates and interposers to perform assembly. Package types available are BGA, CSP, and others. In addition to offering ordinary wire bonding for internal connections