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Rigid Capabilities

Sophic is continuously innovating the technology improving their Rigid PCB capability to meet customers High-Tech requirement with High-Density, High Multilayer, Greater Aspect Ratio, better Impedance Controlled product.

Description Technological Data
Layers 1-30 Layers
Max. Board Size 864 x 610 mm (34" x 24")
Min. Board Thickness 0.2mm (2 layers) / 0.4mm (4 layers) / 0.9mm(8 layers) / 1.2mm (10 layers) / 1.3mm (12 layers) / 1.5mm (14 layers) / 1.7mm (16 layers) / 1.8mm / 2.0 mm (18 layers) / 2.2mm (20 layers) / 2.4mm ( 22 layers) / 2.6mm (24 layers)
Max. Board Thickness 240mil (6mm)
Max. Copper Thickness 6OZ
Min. Inner Line Width /
4mil (0.1mm) / 4mil (0.1mm)
Min. Outer Line Width /
4mil (0.1mm) / 3.5mil (0.089mm)
Min. Finish Hole Size 8mil (0.2mm)
Max. Aspect ratio 10:1
Min.Via/Pad via: dia. 0.2mm / pad: dia. 0.4mm; HDI <0.10mm via
thickness tolerance
±10% (≥1.0mm; ±0.1mm (≤1.0mm))
Finished hole size
tolerance (PTH)
±3mil (0.075mm); press fit: ±2mil (0.05mm)
Finished hole size tolerance (NPTH) ±2mil (0.05mm)
PTH hole copper
min 25um (1.0mil)
Hole Position Deviation ±2mil (0.05mm)
Outline Tolerance ±4mil (0.1mm)
S/M Pitch 3mil (0.08mm)
Insulation Resistance 1 × 1012Ω
Thermal Shock 3 × 10Sec @ 288 °C
Warp and Twist ≤0.5%
Peel Strength 1.4N / mm
Solder Mask Abrasion ≥6H
Flammability 94V - O
Impedance Control ±5%
Mini Solder mask
0.05mm (2mil)
Mini solder mask
0.05mm (2mil)
Mini solder dam 0.076mm (3mil)
Surface Finish
Flash gold (Electrolytic);
Electroless nickel Immersion gold (Electroless Ni/Au);
Organic Solderability Preservatives (OSP or Entek), Hot Air Leveling (=HAL-Tin/Lead);
Hot Air Leveling (Lead- Free, RoHS);
Carbon Ink, Peelable Mask, Gold Fingers (30µ"), Immersion Silver (3~10u"), Immersion Tin (0.6~1.2um).
G/F Au thickness 0.76um max ( 30u” max )
V-cut angle 30° 45° 60°, tolerance +/- 5°
Mini V-cut board
V-cut remain thickness
Profiling mode Routing & Punching
Profiling tolerance ±0.1mm (4mil)
E-TEST voltage 250V ± 5V
Capacity 250,000 square feet (Month)