Skip to main content

Prototype Assembly

Our high quality bare board and components assembly prototyping services speeds up development time for the customer.

Our QTAT (Quick Turn-Around Time) Service for a variety of product lines, reduces the time between the receipt of manufacturing data and the product delivery.

Inquiries on our QTAT services other than the product lines listed below are also welcome. Please feel free to contact us for further information.

QTAT is a registered trademark of Fujitsu Interconnect Technologies, Ltd.

Quick Turn-Around Time Service QTATR®

Please find the preconditions listed below
  • High layer count, high speed PCB QTATR®
    Large size, high layer count (40 layers)
  • High density PCB QTATR®
    Build-up and, sequential laminated construction is applicable.
  • Components assembly QTATR®
    100% guarantee for electrical short-open testing of bare board.

High layer count, high speed PCB QTAT®

Deliver in 5 day (at the earliest) for standard specification of up to 14 layers.
[mm]

Standard Specification Optional Specification
Layer Construction 10~20 22~40
Max Board Thickness 3.2 6
Max Size 580x480 660x810
min Line/Space 0.100 / 0.100 0.080 / 0.085
min Drill Diameter (Finish) 0.35 [0.20] -
Material FR-4 -
High heat resistance FR-4
Surface Treatment Water-soluble preflux Gold electroless plating
Solder coat
Other - Impedance control
Laminated layer construction

Preconditions

1) Please submit:

  • PCB specification at least a week prior to submission of preliminary materials.
  • Preliminary materials at least 3 days prior to order date.
  • Final materials by 3:00pm on the previous day of the order date.
  1. Preliminary materials:
    Outline drawing, aperture list (CD code list), drill list, layer construction drawing (on request basis)
  2. Final materials:
    External dimensions, order quantity, and any modifications of preliminary materials. 

2) Definition of lead time 

  • Saturday and Sunday are not counted as working day.
  • National holidays are counted as working day.
  • Lead time during long holidays such as the year-end and New Year holidays will be separately adjusted.

High density PCB QTATR®

1-N-1, 2-N-2 Build-up PCB
[mm]

Standard Specification Optional Specification
Layer Construction
1-N-1, 2-N-2
(Max 10 layer)
1-N-1, 2-N-2
(MAX 12 layer)
Max Board Thickness 1.6 3
Max Size 480x370 -
min Line/Space 0.075 / 0.075 -
min Laser Via 0.08 -
Material FR-4 -
High heat resistance FR-4
RCC  
Surface Treatment Water-soluble preflux Gold electroless plating
Solder coat
Other - Fill Via
Impedance control
Lamination
Filled surface via hole structure
Surface lid plating

Preconditions

1) Please submit:

  • PCB specification at least a week prior to submission of preliminary materials.
  • Preliminary materials at least 3 days prior to order date.
  • Final materials by 3:00pm on the previous day of the order date.
  1. Preliminary materials:
    Outline drawing, aperture list (CD code list), drill list, layer construction drawing (on request basis)
  2. Final materials:
    External dimensions, order quantity, and any modifications of preliminary materials. 

2) Definition of lead time 

  • Saturday and Sunday are not counted as working day.
  • National holidays are counted as working day.
  • Lead time during long holidays such as the year-end and New Year holidays will be separately adjusted.

Components assembly QTAT®

Accommodates all types of boards
Confine to standard specification, deliver in 4 day (at the earliest)

< Definition of 4 days >
Delivery on the 4th day, counting the day following the date on which all the arrangements  and parts needed for manufacturing are prepared as the 1st day. 

Standard specification
  1. PCB specification
      External dimensions: about 330mm X 250mm,
      Board thickness: about 1.6mm
  2. SMT mounting only
      Adjustment will be needed if component mounting or assembly such as MT, PF, mechanism, etc. is required.
  3. 30 types・1,000 parts/sheet 5 sheets

Preconditions

Prior Information

Receipt of parts list
(Classification of customer-supplied)
6 wks prior to the order acceptance
Receipt of mounting drawing / data 7 days prior to the mounting

PCBA Specification

[mm]
Standard Specification Max Specification
PCBA Size 300 x 250 736 x 620
Thickness 0.4 ~ 8.0
Component Specification BGA / CSP 0.3
QFN / LGA 0.3
Chip
(EIA CODE)
0201 / 0402 Min, 01005 in preparation
Press Fit
Applicable
(Separately adjusted depending on the stock level of the exclusive jigs used. )
Wash N / A Applicable 720 x 720
GTM-PS6H6Z