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  5. Reliability Evalution, Failure Analysis

Reliability Evalution, Failure Analysis

  • We offer an effective advice by leveraging our PCB technologies and manufacturing know-how acquired over the years.
  • We protect information concerning the content and the result obtained through the performance of evaluation and analyses services.

Reliability Evaluation

We provide a wide range of reliability evaluations tailored to varied customer needs and requests.

  • Provide reliability evaluations that comply with relevant standards (JEDEC, MIL, IPC, etc.) for connectivity, insulation, and heat resistance, etc.
  • In addition to reliability evaluation, perform a series of evaluations/analysis from environment/life test to failure analysis.
  • Design and manufacture a test PCB for reliability evaluation on the same day depending on the customer’s needs.

Failure Analysis

We perform a failure analysis best suited for the clarification of the failure mechanism.

  • Investigate up as far as the mechanism by analyzing the defective products to suit each customer's purpose.
  • Accept just visual inspection of connection in PCB/parts or other internal structure or residual analysis alone.

Analysis procedure and sample results

  • Propose an optimal method of analysis to suit each customer’s purpose of analysis.
  • Beginning with non-destructive analysis, we prevent an oversight of symptom by performing destructive analysis
Non-destructive analysisDestructive analysis

Facilities

Representative evaluation facilities

  • Temperature Cycling
  • Thermal Shock
  • OIL-DIP
  • Tensile Tester
  • Temperature Humidity Bias Life Test
  • Highly Accelerated Temperature and Humidity Stress Test

Representative analysis facilities

  • EPMA (Electron Probe Micro-Analysis)
  • AES (Auger electron spectrometer)
  • SEM-EDX (Scanning Electron Microscope) 
  • FT-IR (Fourier Transform Infrared Spectrophotometer) 
  • X-ray Fluorescence Spectrometer
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