High-End Printed Circuit Boards
FICT has the capability to provide advanced technology high end PCB design and manufacturing services. As the functionality and performance of network systems and high-end servers improves, the demand for high-performance printed circuit boards increases. There have been continuing demands for reducing the size and number of layers in new products. Sophisticated interconnect technology has become essential for meeting these needs by improving the density and reliability of PCBs. FICT is the technology leader with solutions that enable its customers to migrate to new and complex designs, while reducing manufacturing time and total cost.
Product Information
- High End Printed Circuit Board Manufacturing
-Up to 52 layers for Production
-52 to 60 layers for Prototyping - Dimensions
-Up to 26" x 28" size
-Up to 0.3" thick
Product Features
- Thin core
- Embedded placement
- Flat pattern processing
- Parallel process
- Advanced materials
- New lamination process
- High density wiring by stacked via
Applications
- Networking (switches, routers, storage, base station)
- Computing (workstations, servers)
