GigaModule 2

---

Key Features

• High Density
• Including Stacked Laser VIA

Core Layer (with Cap Plating)

• Base material thickness: 400 to 800μm
• Pattern thickness: 29μm
• Min.Line/Space: 50/50μm
• Min.Land dia.: 285μm
• Line-Pad Gap: 70μm
• Pad-Pad Gap: 90μm
• Min. Drill dia: 150μm
• Min. Drill pitch:375μm ~pad only

Build Up Layer

• Dielectric thickness: 30μm
• Min. via dia: 60μm
• Pattern thickness: 20μm
• Min.Line/Space: 20/20μm
• Via Land dia.: 100μm
• Min. via pitch.: 120μm ~pad only

Surface

• S/M thickness: 25μm
• Pattern thickness: 20μm
• Via Land dia.: 120μm
• S/M opening dia.: 80μm
• Min. C4 pitch:145μm ~pad only