Fujitsu Interconnect Technologies Limited (FICT) designs and manufactures printed circuit boards and packaging substrates for mobile devices, network systems, high-end servers, and high-speed telecommunication systems.
High-end printed circuit boards
High-End PCB
Advanced technology high-end printed circuit boards (PCBs) design and manufacturing for network systems and high-end servers.
Burn-in test PCB
0.5mm pitch through hole PCB for fine pitch CSP burn-in test applications in mass production.
Buildup PCB
Cutting edge HDI technologies. MV(Multi Via) technology ensure high density wiring capacity in the board including
Packaging Substrates
FC-BGA Substrates (GigaModule)
FICT enables to provide Ultra-Thin & High-density wiring structure, applying core layer free, full build-up, and full stacked-via
technology.
Total Solution
The Total Solution for your PCB and Packaging Substrate needs
Benefits of Working with FICT
Quality Assurance
We apply highly-advanced measuring and analytical equipment with assurance technologies to guarantee advanced features and high quality.
Environmental Policy
We have taken environment conservation into consideration by developing environmentally-conscious PCB technology.
