Fujitsu Interconnect Technologies Limited (FICT) designs and manufactures printed circuit boards and packaging substrates for mobile devices, network systems, high-end servers, and high-speed telecommunication systems.
Printed Circuit Boards
High-End Printed Circuit Boards
Advanced technology high-end printed circuit boards (PCBs) design and manufacturing for network systems and high-end servers
Module & Mobile Printed Circuit Boards
Advanced technology Module and Mobile Printed Circuit Boards (PCBs) design and manufacturing for module and mobile communications
Semiconductor Packaging Substrate
Packaging Substrates
High pin count packaging substrates for network systems, high-end servers, and mobile communication devices
Total Solution
The Total Solution for your PCB and Packaging Substrate needs
Benefits of Working with FICT
Quality Assurance
We apply highly-advanced measuring and analytical equipment with assurance technologies to guarantee advanced features and high quality.
Environmental Policy
We have taken environment conservation into consideration by developing environmentally-conscious PCB technology.

