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Fujitsu Interconnect Technologies Limited (FICT) designs and manufactures printed circuit boards and packaging substrates for mobile devices, network systems, high-end servers, and high-speed telecommunication systems.

Printed Circuit Boards

High-End Printed Circuit Boards
Advanced technology high-end printed circuit boards (PCBs) design and manufacturing for network systems and high-end servers

Module & Mobile Printed Circuit Boards
Advanced technology Module and Mobile Printed Circuit Boards (PCBs) design and manufacturing for module and mobile communications

Semiconductor Packaging Substrate

Packaging Substrates
High pin count packaging substrates for network systems, high-end servers, and mobile communication devices

Total Solution

The Total Solution for your PCB and Packaging Substrate needs

Benefits of Working with FICT

Quality Assurance

We apply highly-advanced measuring and analytical equipment with assurance technologies to guarantee advanced features and high quality.

Environmental Policy

We have taken environment conservation into consideration by developing environmentally-conscious PCB technology.