Semiconductor Manufacturing Services
Press Releases
Semiconductor Manufacturing Services Press Releases
- March 31, 2008 Sunnyvale, CA
- Fujitsu Introduces 65-Nanometer 10G SerDes from Prism Circuits
Sunnyvale, CA, March 31, 2008 – High-Speed Applications Among Key Focus of the U.S.-Based Fujitsu Semiconductor Manufacturing Services Business Group
ASIC Press Releases
- March 31, 2008 Sunnyvale, CA
- Fujitsu Introduces 65-Nanometer 10G SerDes from Prism Circuits
Sunnyvale, CA, March 31, 2008 – High-Speed Applications Among Key Focus of the U.S.-Based Fujitsu Semiconductor Manufacturing Services Business Group
- September 11, 2007 Sunnyvale, CA
- Fujitsu Developing ASICs for GPS Receivers with Industry Leader NovAtel
Sunnyvale, CA, September 11, 2007 – Second ASIC in Series Continues Collaboration between Fujitsu and NovAtel
- February 13, 2007 San Francisco, CA
- Fujitsu Develops Industry’s First CMOS Integrated Circuit that Recovers Clock and Data at 40-44Gbps
San Francisco, CA, February 13, 2007 – Low Power, High Integration Provided by CMOS to Enable 40Gbps Optical SerDes
- September 15, 2006 Tokyo, Japan
- Fujitsu and Advantest to Establish Joint Venture to Create Semiconductor Prototypes Using Electron Beam Direct Lithography
Tokyo, Japan, September 15, 2006 – Fujitsu Limited and Advantest Corporation today announced plans to establish a joint venture to create prototype semiconductors by using electron beam direct lithography.
- September 12, 2006 Sunnyvale, CA
- Fujitsu Now Accepting ASIC Designs for Production Using its 65-Nanometer Process Technology for its North American Customers
Sunnyvale, CA, September 12, 2006 – High Density, Low Power, Small Gate Lengths Ideal for Consumer, Communications Product Designs
- August 29, 2006 Sunnyvale, CA
- Fujitsu Introduces Trio of New Macros for ASIC Designs for 90nm and 110nm
Sunnyvale, CA, August 29, 2006 – New PCI Express, 10G SerDes, Serial ATA Macros Support Server, Wireless, Storage and Desktop Computing Applications
- July 21, 2006 Sunnyvale, CA
- Fujitsu to Provide Industry’s First Comprehensive Environment for Statistical Timing Analysis for Submicron Designs
Sunnyvale, CA, July 21, 2006 – Timing Optimization Turn-around Times to be Reduced by up to 30 Percent
- September 22, 2004 Sunnyvale, CA
- Fujitsu Continues ASIC Leadership with 90-nanometer CS101 CMOS Standard Cell Series
Sunnyvale, CA, September 22, 2004 – Thirteen New Designs Underway Using Leading-Edge 90nm Process Technology
- September 21, 2004 Sunnyvale, CA, and Tokyo, Japan
- Fujitsu and Synplicity Join Forces to Deliver Customized Amplify Product for Fujitsu AccelArray
Sunnyvale, CA, and Tokyo, Japan, September 21, 2004 – Customized Optimization Speeds Time-to-Market and Offers Optimal Performance
- May 10, 2004 Sunnyvale, CA
- Fujitsu Delivers Trio of ASICs to Innovative Start-Up Greenfield Networks
Sunnyvale, CA, May 10, 2004 – Built Using Fujitsu's 0.11-Micron Process Technology, ASIC Includes the First Network Processor Streaming Interface at 1.3 Gigabit/Second
- April 30, 2004 Sunnyvale, CA and Calgary, Canada
- Wi-LAN and Fujitsu Expect to Produce First-to-Market WiMAX Certified System
Sunnyvale, CA and Calgary, Canada, April 30, 2004 – System-on-Chip Engineering Samples Planned for Fall 2004
- November 20, 2003 Sunnyvale, CA
- Fujitsu Introduces ARM9 Multi-CPU Evaluation Device
Sunnyvale, CA, November 20, 2003 – Fujitsu Microelectronics America, Inc. (FMA) today introduced a new ARM9 multi-CPU evaluation device, the MB87Q1100, as part of a platform developed to enable customers to design large, complex systems with very high levels of predictability and efficiency. The MB87Q1100 integrates the ARM926EJ-S and ARM946E-S embedded macrocell cores in Fujitsu's next-generation System-on-Chip (SoC) platform.
- September 24, 2003 Sunnyvale and San Diego, CA
- Pulse~LINK Selects Fujitsu to Co-develop CMOS SoC ASIC
Sunnyvale and San Diego, CA, September 24, 2003 – Pulse~LINK, Inc. and Fujitsu Microelectronics America, Inc. (FMA) today signed an agreement to jointly develop a digital baseband processor using Fujitsu’s 0.11-micron CMOS SoC ASIC solutions. This ASIC will be used in the Pulse~LINK system designed specifically for the world’s first Ultra Wideband Wireless Local Area Network (WLAN).
- September 9, 2003 Sunnyvale, CA
- Fujitsu Delivers a Series of High-Performance ASICs to Foundry Networks
Sunnyvale, CA, September 9, 2003 – Fujitsu, Foundry Networks Continue Strong, Multi-Year Collaboration
- September 9, 2003 Sunnyvale, CA
- Fujitsu Introduces Industry’s First 10Gbps SERDES Macro for Networking Designs
Sunnyvale, CA, September 9, 2003 – Low Power, Low Voltage and High-Performance Macro Maintains Fujitsu’s Leadership in 10Gbps Technology
- April 23, 2003 Sunnyvale, CA
- Fujitsu’ New IP-Phone Chip, Built Around Customized VoiceDSP™
Sunnyvale, CA, April 23, 2003 – SoC, Reference Design Board and Software Deliver Cost-effective, Complete Single-Chip Solution for Carrier Suppliers
- April 14, 2003 Sunnyvale, CA
- Fujitsu Releases System Packet Interface Level-4 I/O Macro
Sunnyvale, CA, April 14, 2003 – Newest in Series of High-end I/Os for SoC ASICs Joins SFI-4, SFI-5, Transceiver Macros
- March 20, 2003 Sunnyvale, CA
- Fujitsu to Deliver a Major Presentation on the 802.16a Standard
Sunnyvale, CA, March 20, 2003 – Fujitsu Microelectronics America, Inc. (FMA), an industry leader in system-on-chip (SoC) technology for the wireless network market, will provide a presentation on the 802.16a standard at the annual Broadband Wireless World Conference at the McEnery Convention Center in San Jose.
- January 14, 2003 San Jose, CA, and Richardson, TX
- Fujitsu Delivers Seven New High Performance ASICs to Texas-Based Chiaro Networks
San Jose, CA, and Richardson, TX, January 14, 2003 – FMA, Chiaro Collaboration Moves ASICs from Design to Fabrication in One Year
- September 18, 2002 San Jose, CA
- Fujitsu Named #2 ASIC Supplier Worldwide by iSuppli
San Jose, CA, September 18, 2002 – Market research firm iSuppli Corporation has named Fujitsu the #2 ASIC supplier worldwide, it was announced today. According to the "Going, Going, Gone - Is There a Place for Second-Tier ASIC Suppliers?" report published in July 2002, Fujitsu moved up two places in 2001, and is now second only to IBM in worldwide ASIC revenue.
- September 18, 2002 San Jose, CA
- New Macros from Fujitsu Deliver Low Power, Low Cost CMOS Performance to 10 Gigabit Ethernet
San Jose, CA, September 18, 2002 – XAUI-compliant Transceiver, 3.125 Gig/second Parallel CDR Transceiver Provide Highly Integrated Industry-Standard Macros in Fujitsu's 0.11 Micron CMOS Technology
- June 4, 2002 Orlando, FL and San Jose, CA
- Delivery of Groundbreaking High-Speed Peer-To-Peer Mobile Broadband ASIC
Orlando, FL and San Jose, CA, June 4, 2002 – First-of-its-Kind Chip Will Drive Deployment of Cost-effective Mobile Broadband Applications and Subscriber Devices
- June 4, 2002 San Jose, CA
- Fujitsu Introduces 90-Nanometer Process Technology in North America
San Jose, CA, June 4, 2002 – New 90-Nanometer Capability Ready for New Generation of Server, Network, Storage, Mobile Products
- June 4, 2002 San Jose, CA
- Fujitsu Introduces Two SERDES Framer Interface Macros for System-on-Chip ASICs
San Jose, CA, June 4, 2002 – OIF-Compliant Cores Provide Pre-Verified Building Blocks for Efficient Application Design
- March 25, 2002 San Jose, CA
- Fujitsu Introduces High-speed, High-density 0.11 micron CS91 Standard Cell Series
San Jose, CA, March 25, 2002 – Offers Large Selection of Standard Cell Libraries, Memory Macros, IP Cores
- March 13, 2002 San Jose, CA
- Fujitsu' New VOIP CODEC Supports Four Simultaneous Channels
San Jose, CA, March 13, 2002 – Built Around ARC Core with DSP Extensions, Aimed at Voice Client Applications
- February 26, 2002 San Jose, CA
- Fujitsu New Bluetooth Baseband IC Series Provides On-board Flash, USB Ports
San Jose, CA, February 26, 2002 – Built Around Parthus’ BlueStream Core, New MB86C00, MBG011 Target Hands-Free Cell Phones and Other Mobile Wireless Applications
Foundry Services Press Releases
- March 31, 2008 Sunnyvale, CA
- Fujitsu Introduces 65-Nanometer 10G SerDes from Prism Circuits
Sunnyvale, CA, March 31, 2008 – High-Speed Applications Among Key Focus of the U.S.-Based Fujitsu Semiconductor Manufacturing Services Business Group
- May 24, 2007 Tokyo, Japan, Sunnyvale and Newport Beach, CA
- Jazz and Fujitsu to Collaborate on Providing Complete Solution for 90nm and 65nm RF CMOS Foundry Customers
Tokyo, Japan, Sunnyvale and Newport Beach, CA, May 24, 2007 – IP Providers Transmeta and Tensilica to Join Fujitsu in Booth 833
- January 26, 2007 Sunnyvale, CA
- Fujitsu to Feature Advanced 65-Nanometer Process Technology, 10Gbps Ethernet Switch Chip at DesignCon 2007
Sunnyvale, CA, January 26, 2007 – IP Providers Transmeta and Tensilica to Join Fujitsu in Booth 833
- October 10, 2006 San Jose, CA
- Fujitsu to Feature World-class 65-Nanometer Process Technology for Advanced Networking, Mobile Applications at 12th Annual
FSA Conference
San Jose, CA, October 10, 2006 – CS200HP / 200A, Part of Fujitsu’s Turnkey Services for Customers, at Booth #410
- September 15, 2006 Tokyo, Japan
- Fujitsu and Advantest to Establish Joint Venture to Create Semiconductor Prototypes Using Electron Beam Direct Lithography
Tokyo, Japan, September 15, 2006 – Fujitsu Limited and Advantest Corporation today announced plans to establish a joint venture to create prototype semiconductors by using electron beam direct lithography.
- June 13, 2006 Tokyo, Japan
- Fujitsu, NEC Electronics, Renesas, and Toshiba to Aim for Standardization of Semiconductor Process Technology for Next-Generation
LSI
Tokyo, Japan, June 13, 2006 – Fujitsu Limited ("Fujitsu"), NEC Electronics Corporation ("NEC Electronics"), Renesas Technology Corp. ("Renesas Technology"), and Toshiba Corporation ("Toshiba") today announced that they have agreed to seek to define a standard process technology that can be applied to the manufacture of advanced system LSIs at the 45-nanometer (nm)* generation and beyond.
- June 13, 2006 Tokyo, Japan
- Fujitsu and Lattice Strengthen Partnership
Tokyo, Japan, June 13, 2006 – Fujitsu Limited and Lattice Semiconductor Corporation today announced that they have signed a distribution agreement in which Fujitsu Devices Inc. will be added as an authorized distributor of Lattice's FPGA/PLD products in Japan.
- June 13, 2006 Sunnyvale, CA
- Fujitsu to Feature Success at 65-Nanometer Process Technology at Fabless Semiconductor Association Forum June 14
Sunnyvale, CA, June 13, 2006 – “Fujitsu at 65nm” Presentation to Focus on Challenges of Deep Submicron Process
- February 6, 2006 Sunnyvale, CA
- Fujitsu to Highlight New 65-Nanometer Process Technologies, 10 Gigabit Ethernet and the WiMAX SoC at Annual DesignCon 2006,
Booth 641
Sunnyvale, CA, February 6, 2006 – “65nm CMOS Process Technology” TecPreview Session Set for Feb. 7 at 10:15 a.m.
- January 11, 2006 Tokyo, Japan
- Fujitsu to Construct New Fab for Logic Chips Employing 65nm Process Technology and 300mm Wafers
Tokyo, Japan, January 11, 2006 – Fujitsu Limited today announced that it will construct a new fab to mass-produce logic semiconductors employing leading-edge 65-nanometer (nm) process technology and 300 millimeter (mm) wafers.
- November 2, 2005 Fremont, CA and Tokyo, Japan
- Fujitsu to Manufacture Leading-edge 3D Graphics Processors for S3 Graphics
Fremont, CA and Tokyo, Japan, November 2, 2005 – Fujitsu's 90 nanometer technology enables high performance graphics chips featuring high speeds and low power consumption
- October 3, 2005 Sunnyvale, CA
- Fujitsu to Feature Industry-Leading Process Technology, Packaging Services in Booth 535 at Annual Fabless Semiconductor Association
Conference
Sunnyvale, CA, October 3, 2005 – Senior VP Keith Horn to Present "Beyond the IDM Business Model" October 5
- September 20, 2005 Sunnyvale, CA
- Fujitsu Introduces World-class 65-Nanometer Process Technology for Advanced Server, Mobile Applications
Sunnyvale, CA, September 20, 2005 – CS200/CS200A Offers Top Performance, Low Power with 25 Percent Gate Size Reduction
- April 18, 2005 Sunnyvale, CA
- IDM Business Model, Advanced Design and Technology Processes Detailed in New White Paper from Fujitsu
Sunnyvale, CA, April 18, 2005 – Describes Complete Capability Portfolio for 300mm, 90nm Custom Silicon
Advanced Packaging Press Releases
- March 31, 2008 Sunnyvale, CA
- Fujitsu Introduces 65-Nanometer 10G SerDes from Prism Circuits
Sunnyvale, CA, March 31, 2008 – High-Speed Applications Among Key Focus of the U.S.-Based Fujitsu Semiconductor Manufacturing Services Business Group
- July 15, 2002 San Jose, CA
- Fujitsu Introduces Industry's Smallest Chip-Size Module with Advanced System-in-Package Technology
San Jose, CA, July 15, 2002 – SiP Technology Enables MCPs as Small as their Largest Individual Device
- May 20, 2002 Santa Clara, CA
- ISSI Introduces New Stacked Multi-Chip Modules for Mobile Communications Market
Santa Clara, CA, May 20, 2002 – Integrated Silicon Solution, Inc. (Nasdaq: ISSI), a leader in advanced memory solutions, today introduced a new family of stacked multi-chip package (MCP) Flash and SRAM memory products. The new products combine ISSI's 8Mb low-power asynchronous SRAM with Fujitsu's 64Mb or 32Mb NOR-type Flash memory in a stacked multi-chip module with fine-pitch ball grid array (FBGA).
- March 25, 2002 San Jose, CA
- Fujitsu Introduces Industry's First Eight-Stacked Multi-Chip Package for Mobile
San Jose, CA, March 25, 2002 – IC Cards, Compact Hard Drives Now Support Three-stacked Chips in One Package
- February 20, 2002 San Jose, CA
- Fujitsu Introduces High-Capacity Four-Stacked MCP and Two-Stacked MCP
San Jose, CA, February 20, 2002 – Two New MCPs Provide Industry's Largest Memory Capacity for Mobile Devices
