Packages
Packaging is a key technology that enables the miniaturization of electronic products. Fujitsu Microelectronics is in volume production of packages such as CSP (Chip Size Package or Chip Scale Package) and BGA (Ball Grid Array), which support high-density wiring technology.
Fujitsu also has a lineup of super-compact packages, including FBGA (Fine Pitch BGA) and WL-CSP (Wafer Level CSP), and high-pin-count packages such as PBGA (Plastic BGA) and TEBGA (Thermal Enhanced BGA). In addition, Fujitsu Microelectronics is now in production of the world’s smallest SON packages, which enable minimum size and weight limitations in today’s portable electronic applications.
Package Overview
| Package type | Package structure | Pin count | I/O frequency (GHz) | Heat resistance ja(ºC/W) (0m/s) | Application | |
|---|---|---|---|---|---|---|
 |
FC-CBGA |  |
450 to 2116 | Max. 5 | Min. 7 | Routers, Servers, Workstations, Backbone transmission devices |
| FC-PBGA |  |
450 to 2116 | Max. 2.5 | Min. 7 | ||
| FC-PBGA |  |
450 to 1156 | Max. 2.5 | Min. 9 | Routers, Personal computers, Graphics, Digital TVs, Set top boxes, Ink-jet printers | |
| TEBGA |  |
256 to 1156 | Max. 1.6 | Min. 13 | ||
| PBGA |  |
256 to 1156 | Max. 1.6 | Min. 15 | ||
 |
||||||
| FBGA |  |
66 to 906 | Max. 1 | 25 to 40 | Personal computers, Mobile phones, Digital video cameras, Digital still cameras, PDAs | |
| WL-CSP |  |
42 to 195 | Max. 2.5 | 25 tp 60 | Mobile phones, Digital video cameras, Digital still cameras, PDAs | |
| QFP LQFP |
 |
48 to 304 | Max. 2.5 | 15 to 100 | Personal computers, Digital TV, Set top boxes, Ink-jet printers |
| Supporting Documents | ||
 IC Package
|
PDF 5.1MB | |
