Connectors
PCB and I/O interconnects for the latest standards and technologies. Copper interconnects in a scaleable performance range for a variety of high-speed module applications.
Resources
Recent Press Releasesmore 
- July 8, 2009
- Fujitsu Releases Vertical-Mount, SMT DDR2 DIMM Socket With Improved Module Mating and Low Lead Coplanarity
Sunnyvale, CA, July 8, 2009 – Fujitsu Components America, Inc. today introduced a vertical, surface-mount DDR2 (double data rate) DIMM (dual in-line memory module) socket connector with an enhanced contact design and 0.1mm lead coplanarity.
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- July 10, 2007
- Techniz Announces SST Technology License Agreement with Fujitsu
Sunnyvale, CA, July 10, 2007 – Techniz, Inc., a high-growth startup developing a new generation of high-speed interconnection systems for use within electronic products, today announced a license agreement with Fujitsu Component Limited (TSE: 6719). Under this agreement, Techniz will provide Self-adjusting Solder Tail Technology (SST Technology) for use in future Fujitsu SMT connector designs, including high-speed backplane connectors, mezzanine connectors and sockets. Techniz SST Technology will improve the reliability and dramatically accelerate the performance of the Fujitsu connectors.
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- April 16, 2007
- Fujitsu Adds Micro SD Connectors to Line Up
Sunnyvale, CA, April 16, 2007 – Expanding its PCMCIA card connector offering, Fujitsu Components America, Inc. today released a very low-profile connector for micro SD/TransFlash™ cards. With a mounted height of 1.6mm, it is the lowest profile connector currently available for micro SD cards.
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- March 26, 2007
- Fujitsu Develops 3D Polymer Waveguide and a Waveguide-Integrated, 4-Channel Optical Parallel Transceiver
Sunnyvale, CA, March 26, 2007 – Fujitsu Components America, Inc. today announced that a collaboration between its parent company, Fujitsu Components Limited, and Fujitsu Laboratories, Ltd. has resulted in the development of a three-dimensional (3D) polymer optical waveguide and a bi-directional, 4-channel optical parallel transceiver utilizing the 3D polymer optical waveguide as an optical integration platform, which simplifies the structure and assembly of the transceiver.
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- April 25, 2006
- Fujitsu Introduces High-Density I/O Connector Module for Space-Efficient, High-Speed Signal Transmission
Sunnyvale, CA, April 25, 2006 – Fujitsu Components America, Inc. today released the first in a series of new connector modules for 4x I/O to support high-speed signal transmission. The new modules offer a compact, cost-efficient way to increase I/O port density and available printed circuit board (pcb) space, while simplifying high-speed signal routing on the main pcb.
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Vertical Mount, DDR2 DIMM socket features new contact design
A patented, split-beam contact design boosts module mating reliability even in high-vibration environments.
Fujitsu introduces ultra-thin micro SD connector
Using advance technology, new connector has lowest profile for micro SD cards.
PDF Datasheet | Press release
High-Density I/O Module Supports 4x Requirements
The Fujitsu Multi-IO microGiGaCN™ series product supports high speed signal transmission in compact package and easy
to install structure. This series of modules incorporates Fujitsu’s world standard high-speed differential 4 channel IO socket
interface which is defined by SFF 8470, InfiniBand™, 10G Base-CX4, and 10G Fiber Channel. The module is designed to
meet InfiniBand DDR, along with the previously mentioned industry standards, in a 4channel, bi-directional data transfer mode.
The Multi-IO connector module allows for increased I/O port density, while allowing for ease of signal routing on the main
pcb.
PDF Datasheet | Press release
