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WL-CSP Package

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WL-CSP

Features

Ultra compact, ultra thin, multi-pin, and superior humidity and reflow resistance by wafer through-hole interconnections.

  • Ultra compact, ultra thin, and light weight suitable for mobile devices and digital electric household appliances.
  • Superior humidity and reflow resistance with JEDEC Level 1 standard.
  • Support for pin pitch at less than 0.4mm contributing towards multi-pin.
  • High speed transmission by reducing the wire length.
  • Fully customizable according to the customer's requirements.

WL-CSP External view

WL-CSP External view

WL-CSP Processes

WL-CSP Processes

WL-CSP Package cross section

WL-CSP Package cross section

WL-CSP Road map


2010 2011 2012
WL-CSP
Structure
Height(Min) 0.25 mm
Ball/Land pitch (Min) 0.30 mm 0.25 mm
Ball/Land dia. (Min) 0.15 mm 0.13 mm
RDL Technology Line/Space 20µm/15µm 15µm/15µm
Via/Land Pitch(Inline) 50µm 40µm
Others Wafer size 150/200/300mm
(6/8/12inch)
Scribe Width
(Min) 6/8 in 12 in
90µm
90µm (<0.35-t)
100µm (>0.35-t)
Solder Pb Free
Mold resin Halogen Free

WL-CSP Mass-production actual performance

WL-CSP WLP112 WLP309 WLP15 WLP42 WLP70-02 WLP143
Wafer Size 200 mm 200 mm 200 mm 300 mm 300 mm 300 mm
Package Size 6.46 × 6.46 mm 7.56 × 7.56 mm 7.77 x 1.77 mm 3.30 × 2.95 mm 3.408 × 4.486 mm 7.81 × 6.10 mm
Package Height 0.6mm Max 0.8mm Max 0.64mm Max 0.50mm Max 0.35mm Max 0.55mm Max
Chip Thickness 390µm TYP 520µm TYP 390µm TYP 300µm TYP 220µm TYP 350µm TYP
Encapsulant Thickness 50µm TYP 50µm TYP 50µm TYP 50µm TYP 50µm TYP 50µm TYP
Ball Pitch 0.5 mm 0.4 mm 0.4 mm 0.4 mm 0.4 mm 0.5 mm
Ball Height 110µm TYP 150µm TYP 150µm TYP 100µm TYP 100µm TYP 100µm TYP