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TEBGA Package

 Overview |  SOP/TSSOP |  QFP/LQFP/TEQFP/HQFP |  SON/QFN |  FBGA |  PBGA | TEBGA |  FC-BGA |  WL-CSP |  Bump on Pad |


title-tebga

Features

  • Superior thermal characteristics.
  • Superior support for multi-pin.
  • Package sizes at 27mmSQ and 35mmSQ are available.

TEBGA Package external view

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TEBGA Package cross section

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TEBGA Package line-up

Package code Pin count Package size Pin arrangement Pin pitch
(mm)
Total Number of TBs*
included
X Y
BGA-320P-Mxx 320 64 27.0 27.0 4 rows 1.27
BGA-416P-Mxx 416 64 35.0 35.0 4 rows 1.27
BGA-416P-M06 416 64 35.0 35.0 4 rows 1.27
BGA-480P-Mxx 480 64 27.0 27.0 5 rows 1.00
BGA-484P-M09 484 64 27.0 27.0 5 rows 1.00
BGA-484P-M08 484 64 35.0 35.0 5 rows 1.27
BGA-520P-Mxx 520 100 35.0 35.0 5 rows 1.27
BGA-543P-M01 543 64 27.0 27.0 6 rows 1.00
BGA-544P-M02 544 64 27.0 27.0 6 rows 1.00
BGA-676P-M10 676 - 27.0 27.0 Full Matrix 1.00
BGA-676P-M12 676 100 35.0 35.0 5 rows 1.00
BGA-770P-Mxx 772 100 35.0 35.0 6 rows 1.00
BGA-808P-M01 808 144 35.0 35.0 5 + 2 rows
(with nonexistent pins)
1.00
BGA-868P-M01 868 196 35.0 35.0 6 rows 1.00
BGA-900P-M08 900 144 35.0 35.0 7 rows 1.00
BGA-1156P-M11 1156 - 35.0 35.0 Full Matrix 1.00

*TB : Thermal Ball