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SON and QFN Package

 Overview |  SOP/TSSOP |  QFP/LQFP/TEQFP/HQFP |  SON/QFN |  FBGA |  PBGA |  TEBGA |  FC-BGA |  WL-CSP |  Bump on Pad |


title-son

Features

  • Thin and compact.
  • Better cost performance compared to BGA.

SON and QFN Package external view

img-sonSON img-qfnQFN

SOP and TSSOP Package cross section

illust-son

SON Package line-up

Package size (mm) Mounting height (mm) Pin count
X Y Pin pitch 0.65mm Pin pitch 0.50mm Pin pitch 0.40mm
1.80 2.85 0.80 Max. 6 - -
2.0 2.0 - 8 -
3.0 3.0 - 10 -

QFN Package line-up

Package size (mm) Mounting height (mm) Pin count
X Y Pin pitch 0.65mm Pin pitch 0.50mm Pin pitch 0.40mm
2.5 3.5 0.80 Max. - - 24
3.0 3.0 - 16 20
4.0 4.0 16 16/20/24 28
5.0 5.0 - 28/32 40
6.0 6.0 - 40 48
7.0 7.0 - 48 56
8.0 8.0 - - 68
9.0 9.0 - 64 -