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QFP Package

 Overview |  SOP/TSSOP |  QFP/LQFP/TEQFP/HQFP |  SON/QFN |  FBGA |  PBGA |  TEBGA |  FC-BGA |  WL-CSP |  Bump on Pad |


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Features

  • Equipped with outer leads at the four corners of the package.
  • Superior cost performance with a mature technology.
  • High reliability in mounting the package on printed circuit boards.
  • TEQFP and HQFP can be mounted with a chip with high heat emission because of its high efficiency in heat dissipation.

QFP Package external view

img-lqfp img-teqfp
LQFP/LQFP TEQFP

QFP and LQFP Package cross section

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TEQFP Package cross section

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QFP Packages line-up

Package type Package size (mm) Mounting height (mm) Pin count
X Y Pin pitch 0.65mm Pin pitch 0.50mm Pin pitch 0.40mm
QFP 14.0 20.0 3.35 Max. 100 - -
28.0 28.0 3.95 Max. - 208 -
4.03 Max. - - 256
32.0 32.0 - 240 -
LQFP
TEQFP
7.0 7.0 1.70 Max. - 48 64
10.0 10.0 52 64 -
12.0 12.0 64 80 -
14.0 14.0 - 100 -
16.0 16.0 - 120 144
20.0 20.0 - 144 -
24.0 24.0 - 176 216
28.0 28.0 - 208 256
HQFP 28.0 28.0 3.95 Max. - 208 -
4.03 Max. - - 256
32.0 32.0 - 240 296
40.0 40.0 4.10 Max. - 304 -