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FBGA Package

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Features

  • Fine pitch (pin pitch from 0.4mm) and thin.
  • Superior electrical characteristics and reliability.
  • Plentiful line-up and customization support.

FBGA Package external view

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FBGA Package cross section

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CSP Road map

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Fujitsu will provide the most suitable SiP to the customer's requirements with our extensive implementation technologies.
Please do not hesitate to contact us.

Module Package Road map

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FBGA Package line-up

Pin pitch: 0.5mm (Less than 500pin)

Package code Pin count Package size (mm) Pin arrangement
Total Number of TBs* included X Y
BGA-66P-M01 66 9 5.0 5.0 2 rows
BGA-82P-M01 82 9 6.0 6.0 2 rows
BGA-96P-M04 96 0 6.0 6.0 3 rows
BGA-100P-M03 100 0 7.0 7.0 2 + (1) + 1 rows
BGA-112P-M05 112 0 7.0 7.0 3 rows
(with nonexistent pins)
BGA-130P-M02 130 9 7.0 7.0 3 rows
BGA-144P-M09 144 0 7.0 7.0 4 rows
BGA-168P-M03 168 25 9.0 9.0 3 rows
(with nonexistent pins)
BGA-208P-M01 208 0 9.0 9.0 4 rows
BGA-232P-M01 232 0 12.0 12.0 2 + (1) + 2 rows
BGA-240P-M02 240 49 10.0 10.0 4 rows
BGA-240P-M03 240 0 10.0 10.0 4 rows
BGA-289P-M01 289 25 10.0 10.0 3 + (1) + 2 rows
BGA-304P-M05 304 0 13.0 13.0 2 + (1) + 2 rows
BGA-304P-M07 304 0 12.0 12.0 4 rows
BGA-337P-M02 428 81 13.0 13.0 4 rows
BGA-345P-Mxx 345 25 12.0 12.0 2 + (1) + 2 + (1) + 1 rows
BGA-385P-M01 434 49 13.0 13.0 3 + (1) + 2 rows
BGA-385P-M02 385 81 13.0 13.0 2 + (2) + 2 rows
BGA-385P-M03 385 81 12.0 12.0 4 rows
BGA-400P-M04 481 81 15.0 15.0 4 rows

*TB : Thermal Ball

Pin pitch: 0.5mm (500pin or more)

Package code Pin count Package size (mm) Pin arrangement
Total Number of TBs* included X Y
BGA-506P-Mxx 506 81 14.0 14.0 3 + (1) + 2 rows
BGA-562P-M03 562 81 14.0 14.0 3 + (1) + 3 rows
BGA-586P-Mxx 586 121 15.0 15.0 3 + (1) + 2 rows
BGA-586P-M04 586 49 15.0 15.0 4 + (1) + 2 rows
BGA-610P-M01 610 121 16.0 16.0 3 + (2) + 2 rows
BGA-650P-M03 650 169 15.0 15.0 5 rows
BGA-753P-Mxx 753 169 18.0 18.0 3 + (1) + 2 rows
BGA-770P-M01 770 121 16.0 16.0 4 + (1) + 3 rows
BGA-842P-Mxx 842 169 18.0 18.0 3 + (1) + 2 rows
BGA-906P-Mxx 906 169 18.0 18.0 3 + (1) + 2 + (1) + 2 rows

*TB : Thermal Ball

Pin pitch: 0.65mm

Package code Pin count Package size (mm) Pin arrangement
Total Number of TBs* included X Y
BGA-176P-M05 176 0 11.0 11.0 4 rows
BGA-204P-M01 204 0 11.0 11.0 3 + (1) + 2 rows
BGA-240P-M07 240 0 13.0 13.0 4 rows
BGA-252P-M01 252 0 13.0 13.0 5 rows
(with nonexistent pins)
BGA-280P-M03 280 0 13.0 13.0 5 rows
BGA-360P-M05 441 81 16.0 16.0 5 rows
BGA-385P-M04 385 25 16.0 16.0 5 rows

*TB : Thermal Ball

Pin pitch: 0.80mm

Package code Pin count Package size (mm) Pin arrangement
Total Number of TBs* included X Y
BGA-112P-M04 112 0 10.0 10.0 4 rows
BGA-144P-M06 144 0 12.0 12.0 4 rows
BGA-144P-M07 144 0 12.0 12.0 4 rows
(with nonexistent pins)
BGA-176P-M04 176 0 12.0 12.0 5 rows
(with nonexistent pins)
BGA-188P-M01 188 0 15.0 15.0 4 rows
(with nonexistent pins)
BGA-192P-M06 192 - 12.0 12.0 Full Matrix
(with nonexistent pins)
BGA-224P-M06 224 0 16.0 16.0 4 rows
BGA-224P-M08 260 36 16.0 16.0 4 rows
BGA-224P-M09 288 64 16.0 16.0 4 rows
BGA-240P-M06 240 0 15.0 15.0 5 rows
BGA-256P-M17 259 49 18.0 18.0 2 + (1) + 2 rows
BGA-272P-M06 321 49 18.0 18.0 4 rows
BGA-272P-M08 272 0 18.0 18.0 4 rows
BGA-320P-M05 369 49 18.0 18.0 5 rows
BGA-441P-M01 441 - 18.0 18.0 Full Matrix

*TB : Thermal Ball