Fujitsu Microelectronics America, Inc.
Fujitsu to Feature Industry-Leading Process Technology, Packaging Services in Booth 535 at Annual Fabless Semiconductor Association Conference
Senior VP Keith Horn to Present “Beyond the IDM Business Model” October 5
Sunnyvale, CA, October 3, 2005 — Fujitsu Microelectronics America, Inc. (FMA) will feature Fujitsu's industry-leading 65-nanometer and 90-nanometer process technologies at the annual Fabless Semiconductor Association Suppliers Expo and Conference October 5-6 at the San Jose Convention Center.
Fujitsu will present its wafer foundry, package foundry and full turnkey services, along with a video that describes its latest process technology at the new Mie, Japan, fabrication facility. The company will exhibit its new 300mm wafer from the Mie factory, and describe its global leadership in low-power and low-leakage process capabilities.
Also on display will be Fujitsu's comprehensive set of packaging options that support very high pin counts for a variety of high-performance applications. Packages include MCP, SiP, BCC, and EBGA, along with organic and ceramic Flip-chip BGA, all available as part of Fujitsu's one-stop turkey packaging services, which include design, simulation, assembly, and test.
Highlighting "Green Solutions" and Processes
In addition, Fujitsu will highlight its environmentally friendly and safe production facilities, along with its innovative
lead-free packaging. Fujitsu's environmental commitments include "green solutions" such as reduced waste and CO2 emissions,
which have been reduced more than 20 percent since fiscal year 2000. By the end of 2005 Fujitsu expects to replace 90 percent
of its most commonly used components with versions that are free of specific hazardous substances. Recycling and re-use rates
also are increasing dramatically at all the company's facilities.
Horn to Present "Beyond the IDM Business Model"
Keith Horn, FMA's senior vice president of sales and marketing, will be a featured speaker on October 5 during Track 1 at
2:20 p.m., with a presentation entitled "Beyond the IDM Business Model." The presentation will highlight Fujitsu's flexible,
versatile customer engagement models, featuring its commitment to provide specific services – ranging from flexible design
methodologies to a comprehensive set of IPs – as part of development alliances tailored to specific customer needs.
"Fujitsu is dedicated to providing the comprehensive engineering and development support required to execute new generations of complex ICs and solutions using the world’s leading process technologies," said Horn. "Our business model has been designed specifically to support fabless suppliers from the very earliest stages of product development through to complete silicon implementations, including all phases of design and production."
Fujitsu's wafer fab services offer a full line-up of technologies including CMOS logic, mixed signal, LCOS, and high voltage for various applications such as computing, storage, networking, wireless, and consumer products. Fujitsu's production-proven wafer process provides customers with industry-leading performance such as the company's enhanced 90nm and the 65nm process. Coupled with Fujitsu's proven process technologies, the company offers a full line-up of libraries, IP's and dedicated engineering resources to bring your design ideas to production.
Technology Backgrounder
A technology backgrounder on "High-performance / Low-power 65-nanometer CMOS Technology" is available on the website.
This paper describes Fujitsu's CS200/CS200A series 65nm CMOS technology with a focus on the technology's improved performance
and low power consumption. Visit http://www.fujitsu.com/us/services/edevices/microelectronics/foundryservices/whitepaper/65nm.html
A technology backgrounder on "Your Best Choice for a 300mm, 90nm Foundry is Fujitsu" is also available on the website. This paper discusses Fujitsu's Integrated Device Manufacturing (IDM) service business model. IDM is designed to provide specific services – ranging from flexible design methodologies to a comprehensive set of IPs – as part of development alliances tailored to specific customer needs. Visit http://www.fujitsu.com/us/services/edevices/microelectronics/foundryservices/whitepaper/90nm.html
About Fujitsu Microelectronics America, Inc.
Fujitsu Microelectronics America, Inc. (FMA) leads the industry in innovation. FMA provides high-quality, reliable semiconductor products and services for the networking, communications, automotive, security and other markets throughout North and South America. For product information, visit the company web site at http://us.fujitsu.com/micro/wafer or please address e-mail to inquiry@fma.fujitsu.com
Press Contacts
Emi Igarashi
Fujitsu Microelectronics America, Inc.
Tel: 408.737.5647
E-mail:eigarash@fma.fujitsu.com
Dick Davies
IPRA
Tel: 415.777.4161
E-mail:ipra@mindspring.com
