Fujitsu Microelectronics America, Inc.

Fujitsu Microelectronics America Introduces High-Density Six-Chip Stacked Memory MCP for Cellular Applications

Advanced new PS-MCP technology serves exciting new cellular telephone capabilities

San Jose, CA, October 31, 2002 — Fujitsu Microelectronics America, Inc. (FMA) today introduced a high-density, large-scale Multi-Chip Package (MCP) that stacks three flash, one SRAM, and two Fast Cycle RAM (FCRAMTM) devices in a single package for cellular phone applications.

The new six-chip MB84VY6A4A1 MCP uses Fujitsu's new Package Stacked Multi-chip Package (PS-MCP) technology to bond a pair of packages into a single unit that includes all six memory chips. The package is divided into two independent data buses, so data and programs can be processed simultaneously, significantly reducing processing time. The new product is based on Fujitsu's PS-MCP technology, which was introduced in March 2002.

The stacked MCP is designed for the cellular phone market, which now requires the full range of different types of memory to serve a variety of new functions -- such as digital photo capabilities, Internet, music and video distribution -- in addition to phone calls. Memory packages used on cellular phones must now be smaller, with higher densities and larger capacities to serve this expanded cell phone functionality.

"This high-density MCP is a breakthrough product for the new generation of full-function cellular technology," said Keith Horn, vice president of marketing for Fujitsu Microelectronics America. "As cellular phones incorporate video capture, Internet access and other exciting new features, they require significantly more memory in very dense packages. Fujitsu continues to lead the market in delivering the ideal solution to serve these advances in cellular capabilities."

The MB84VY6A4A1 measures 15 mm in length, 11 mm in width, with a height of just 1.4 mm. Ball pitch is 0.8 mm. It is the same size as Fujitsu's four-chip MCP. Memory capacity is increased by approximately 20 percent in the new six-chip version.

The MCP is divided into a four-chip upper package and a two-chip lower package. The upper package includes 128-Mbit NOR-type dual operation flash memory with page read mode, 64-Mbit NOR-type dual operation flash memory, 64-Mbit mobile FCRAM, and 32-Mbit mobile FCRAM. The lower section includes 32-Mbit NOR-type dual operation flash, with 8-Mbit low-power SRAM. The bus width is 16 bits. Operating voltage is 2.85V ± 0.15V, with operating temperature from -25 degrees C to +85 degrees C. The MCP can accommodate up to 100,000 erase/write repetitions.

Pricing and Availability
The new PS-MCP is available in standard plastic 179-pin BGA. Sample prices start at $65 each and will be available by the end of November.

---

About Fujitsu Microelectronics America, Inc.

Fujitsu Microelectronics America, Inc. (FMA) leads the industry in innovation. FMA provides high-quality, reliable semiconductor products and services for the networking, communications, automotive, security, and other markets throughout North and South America. For product information, call 1-800-866-8608, or visit the company web site at www.fma.fujitsu.com/flash

---

Press Contacts

---

FCRAM is a trademark of Fujitsu Limited.