Fujitsu Component Limited

Techniz Announces SST Technology License Agreement with Fujitsu

Sunnyvale, CA, July 10, 2007 — Techniz, Inc., a high-growth startup developing a new generation of high-speed interconnection systems for use within electronic products, today announced a license agreement with Fujitsu Component Limited (TSE: 6719). Under this agreement, Techniz will provide Self-adjusting Solder Tail Technology (SST Technology) for use in future Fujitsu SMT connector designs, including high-speed backplane connectors, mezzanine connectors and sockets. Techniz SST Technology will improve the reliability and dramatically accelerate the performance of the Fujitsu connectors.

Fujitsu plans to incorporate Techniz’ SST Technology into a future high-speed backplane connector system (over 10 Gbps) with SMT feature, and will extend it to other future high-density SMT connectors. Techniz’ SST Technology provides reliable, surface-mount assembly features to accommodate PCB warpage and co-planarity of connector pins. Its unique solder tail design makes high pin counts and smaller-pitch SMT connector assemblies available without defect. The solder tails move during the reflow process and conform to the PCB warpage.

“Techniz’s SST Technology provides a reliable solution for SMT issues inherent in the current generation of high-density, high-pin-count connectors. It will allow our customers to have more confidence when using SMT backplane connectors for their devices,” said Hideo Miyazawa, General Manager, Connector Group, Fujitsu Component Ltd.

“We are extremely pleased to have reached a license agreement with Fujitsu Component, one of the prominent players in the high-speed connector arena. This agreement validates the Techniz approach to interconnection technologies.” said James Jeon, CEO and Founder of Techniz Inc.

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About Fujitsu Component Limited

Fujitsu Component Limited offers relays, connectors, input devices, server console switches such as KVM switches and console drawers, and other electronic components. Fujitsu’s microGiGaCN™ is the one of the most reliable high-speed, board-to-board interconnect solutions. The company is headquartered in Tokyo Japan, with its primary North American sales office located in Sunnyvale, California.

About Techniz, Inc.

Established in 2005, Techniz, Inc. develops high-speed interconnection technologies that meet customers’ requirements for increased performance of electronic products. The company holds various patents covering SMT technology, high-speed G-Flex backplane connector, and other low cross-talk consumer connectors and sockets. G-Flex’s floating head feature enables low-cost, stress-free SMT solder joints. Techniz is headquartered in San Jose, California.

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